Category: Texas Instruments PCI Express, Wireless USB and Memory Support ...
... March 1-3). Designers can experience the use of PCI Express in small, modular split-chassis platform designs and see updates and demos on Wireless USB over ...
DALLAS, Feb. 28 /PRNewswire/ -- Texas Instruments Incorporated (NYSE: TXN)
(TI) will demonstrate the latest in connectivity and memory support integrated
circuit (IC) technology at the Intel Developer Forum (IDF) in San Francisco,
California (March 1-3). Designers can experience the use of PCI Express in
small, modular split-chassis platform designs and see updates and demos on
Wireless USB over ultra wideband (UWB) and the latest in memory support
components. TI will be located in the PCI-Express Community (booth # 904),
the Wireless USB Community (booth # 217) and the Memory Community
(booth # 923). Additionally, TI spokespersons, Anuj Batra, Martin Izzard and
Seema Deshpande, will be sharing their expert insights in sessions and theater
presentations.
* UWB: Hi-Speed WPAN Radio Platform
* Speaker: Anuj Batra, member TI's group technical staff
* Topic: UWB: Hi-Speed WPAN Radio Platform
* Date: Wednesday, March 2nd
* Time: 3:30-4:20 p.m.
* SerDes Test Strategy in Texas Instruments Serial Links Products
Business
* Speaker: Martin Izzard, Director, Serial Link Products
* Date: Wednesday, March 2nd
* Time: 12:45 p.m.
and
* Speaker: Seema Deshpande, Product Line Manager, Serial Link
Products
* Date: Thursday, March 3rd
* Time: 10:15 a.m.
* Location: Memory Community Theater
PCI Express Demo
TI will demonstrate its second generation split-chassis platform based on
PCI Express-to-PCI Bridge technology, which aids OEMs in the design of new,
high-performance equipment for the consumer and corporate PC markets. TI's
demonstration features a PCI Express enabled split-chassis PC that highlights
an ergonomic, user-friendly, easy-to-reach IO hub that allows users to
uncompromisingly reclaim their desk top and office space, reduce noise
pollution and enjoy easier access to all frequently used IO ports. More
specifically, users are able to hide away their bulky towers, place their IO
hub nearby and move a broad range of applications such as USB, 1394
(FireWire), Flash reader/writers, ExpressCard slots, TV tuners, personal video
recorder and more from hard-to-reach access points in their desktops. (See
http://www.ti.com/pciexpress for more information.)
Wireless USB Demo
TI will demonstrate a Wireless USB connection that illustrates consumer
ability to move audio and video data throughout the home and office -- without
the wires of today's USB products. A leader in the industry forums developing
Wireless USB, including Wireless USB Promotor Group, MBOA and WiMedia
Alliance, TI is developing the technology for high-speed, short-range, low-
power wireless transmissions to and from end equipments such as digital
cameras, MP3 players, printers, mobile phones and other mobile devices. (See
http://www.ti.com/uwb for more information.)
Memory Support Components
In the Memory Community TI will display its advanced memory support
solutions, and TI experts will provide information on high-speed memory module
support products, including advanced memory buffers for fully-buffered dual
in-line memory modules (FB-DIMM).
Texas Instruments Incorporated provides innovative DSP and analog
technologies to meet our customers' real world signal processing requirements.
In addition to Semiconductor, the company's businesses include Sensors &
Controls, and Educational & Productivity Solutions. TI is headquartered in
Dallas, Texas, and has manufacturing, design or sales operations in more than
25 countries.
Texas Instruments is traded on the New York Stock Exchange under the
symbol TXN. More information is located on the World Wide Web at:
http://www.ti.com .
SOURCE Texas Instruments Incorporated
Web Site: http://www.ti.com http://www.ti.com/pciexpress
http://www.ti.com/uwb
http://www.intel.com/idf/us/spring2005/systems/index.htm
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Source: PR Newswire (press release) - USA